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KY-HGS 8140C Thermal potting adhesive

Packing Specification
This series of products uses component A; 10kg/plastic drum, B component 1kg/plastic drum packaging; 20kg/plastic drum, 2kg/plastic drum packaging for component B, 25kg/drum packaging for adhesive A, 5kg/drum packaging for adhesive B

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KY-HGS 8140C Thermal potting adhesive

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Product: Thermal Conductive Silicone Sheet; Potting Compound; Thermal Conductive Gel; Electronic Adhesive; Thermal Grease

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